Scopes
mathematical statistics
numerical analysis
mathematical modeling
topology
geometry
Matrix-Vector
Laplace transform
Fourier analysis
function
Mathematical formulas and Eq
Astronomy and celestial movements
Mechanics and theoretical mechanics
Condenser-matter physics and new materials
Structure and physical nature
acoustic
electricity
optics
thermology
Physical experiments and principles
Material physics and chemistry
Physical properties of materials
Material thermodynamics
Material preparation technology
Basis of Materials Engineering
atomic physics
quantum mechanics
solid-state physics
Mechanical properties of the material
photolectric material
microelectronic material
semiconductor
cryogenic conductor
Nanomaterials and nanotechnology
Nano manufacturing
material processing
Synthesis and processing
surface preparation
Dielectric superlattices and their microstructural materials and devices
Media, ferroelectric thin films and integrated devices
Artificial band gap material
Whole-oxide heterostructures and devices
Nanomaterials and nanoelectronics
New functional inorganic non-metallic materials, microstructural material design
High-performance calculations in material design
Nonlinear photonics
Controlled synthesis and assembly of low-dimensional nanomaterials
Nanophotonic materials
Colloid and interface chemistry
Electrochemical and biosensors
Dielectric superlattices and their microstructural materials and devices
Study on the catalyst and the catalytic reaction
New energy development and energy and chemical industry
Clean production and green chemical technology
Polymer engineering
Energy conservation, emission reduction, chemical industry
Process reinforcement
pharmaceutical engineering
Biochemistry and Technology
Electrochemical engineering
Waste disposal and environmental chemicals
Chemical thermodynamics and kinetics
Chemical industry process system and information engineering
Chemical machinery and equipment
Paper-making and fiber engineering
Of Food Science and Engineering
Important Dates | 重要日期
  • Submission Deadline: 2024.5.31
  • Registration Deadline: 2024.6.7
  • Conference Date: 2024.6.8
  • Notification Date: About a week after the submission
Submission Portal | 投稿方式

Mail Address:  ei_cpci_committee@126.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

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  • 3126729259
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