Scopes
(Topics include but are not limited to)
Topic 1: Applied Physics
Condensed Matter Physics and New Materials
Physics and Applied Physics
nuclear physics
Sound/Electricity/Light/Heat
Atomic Physics
Solid state physics
Structure and physical properties
Electrical and Electronic Technology
Semiconductor Physics
Optoelectronics
Optoelectronic Technology and Its Applications
Nuclear electronics
Nuclear Technology and Applications
Vibration, Noise and Their Control
Electro-acoustic technology 
Circuit Principles and Analysis
Quantum Electronic Informatics
Photonics informatics
Space Science and Technology
Topic 2: Material Applications
Deformation and fracture of materials
material processing 
Electronic and Electrical Materials
Mechanical materials
Aviation materials
Plastic research
High performance materials
Material modeling
Process technology category
Structural category
Material Forming and Design
Energy materials
Industrial materials
Mechanical materials
mineral resources
Coatings, Corrosion, and Surface Engineering
Topic 3: Semiconductor Technology
3D stacking and packaging technology
High performance network on chip (NoC)
Adaptive Circuit Design
Power management and heat treatment technology
Advanced process nodes
Neural Network Specific Chip (ASIC/FPGA)
Imitating the computing architecture of the human brain
Integrated storage and computing
Distributed AI Computing Framework
High frequency and high-power applications
Thermal characteristics and heat dissipation technology
Flexible electronics and wearable devices
Advanced storage technology
Phase change memory (PCM)
Magnetic reluctance memory (MRAM)
3D NAND and ReRAM
New materials for non-volatile storage
High density and high-speed storage arrays
Gallium Nitride (GaN) and Silicon Carbide (SiC) Devices
High performance computing chip
Carbon based and compound semiconductors
Electronic applications of carbon nanotubes
Important Dates/重要日期
  • Submission Deadline: 2026.3.1
  • Registration Deadline: 2026.3.6
  • Conference Date: 2026.3.15
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  icipse_info@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

肖老师
  • +86-17172888836(微信同号)
  • 3770887106
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