Scopes
Topic 1: Intelligent Communication
Intelligent computing applications
Information System Security and Management
Computer Networks and Communication
Mobile communication and wireless technology
Communication Network and Its Management
Network Engineering and Security
Information security algorithms and protocols
5G mobile communication and intelligent computing communication
Intelligent Communication/Information Security
Topic 2: Semiconductor Technology
3D stacking and packaging technology
High performance network on chip (NoC)
Adaptive Circuit Design
Power management and heat treatment technology
Advanced process nodes
Neural Network Specific Chip (ASIC/FPGA)
Imitating the computing architecture of the human brain
Integrated storage and computing
Distributed AI Computing Framework
Carbon based and compound semiconductors
Electronic applications of carbon nanotubes
Topic 3: Integrated Circuit Design and Manufacturing
High performance integrated circuit design
Digital Circuit Design
Analog Circuit Design
ADC/DAC design
Low power logic circuit design
FPGA architecture design
Embedded processors and system design
RF front-end design and optimization
Integrated Sensor Design
Micro processing technology
Lithography technology
Advanced packaging technologies such as TSV and CuNCAP
Aging and Fault Analysis of Integrated Circuits
Integrated Circuit Safety
Design and Optimization of Integrated Electric Vehicle Drive System
Fault diagnosis and repair technology
Intelligent computing applications
Information System Security and Management
Computer Networks and Communication
Mobile communication and wireless technology
Communication Network and Its Management
Network Engineering and Security
Information security algorithms and protocols
5G mobile communication and intelligent computing communication
Intelligent Communication/Information Security
Topic 2: Semiconductor Technology
3D stacking and packaging technology
High performance network on chip (NoC)
Adaptive Circuit Design
Power management and heat treatment technology
Advanced process nodes
Neural Network Specific Chip (ASIC/FPGA)
Imitating the computing architecture of the human brain
Integrated storage and computing
Distributed AI Computing Framework
Carbon based and compound semiconductors
Electronic applications of carbon nanotubes
Topic 3: Integrated Circuit Design and Manufacturing
High performance integrated circuit design
Digital Circuit Design
Analog Circuit Design
ADC/DAC design
Low power logic circuit design
FPGA architecture design
Embedded processors and system design
RF front-end design and optimization
Integrated Sensor Design
Micro processing technology
Lithography technology
Advanced packaging technologies such as TSV and CuNCAP
Aging and Fault Analysis of Integrated Circuits
Integrated Circuit Safety
Design and Optimization of Integrated Electric Vehicle Drive System
Fault diagnosis and repair technology
Important Dates | 重要日期
- Submission Deadline: 2025.6.3
- Registration Deadline: 2025.6.8
- Conference Date: 2025.6.23
- Notification Date: About a week after the submission
Submission Portal | 投稿方式
Mail Address: ei_dscis@126.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
唐老师
17168296597
3264234551
田老师
17162865530
3766818743
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