Scopes
(The following topics include but are not limited to)
Topic 1. Advanced semiconductor devices
New semiconductor materials and their Applications in devices Design and optimization of high-performance MOSFET
Power device technology for energy efficiency optimization
III-V compound semiconductor devices beyond silicon
Micro-electric semiconductor sensor and its application
Semiconductor lasers and their emerging applications
Graphene and other 2D materials devices
Quantum dot and quantum well semiconductor devices
New memory devices: RRAM, MRAM, FeRAM
Challenges and opportunities for cryoelectronic devices
Breakthrough technology for high frequency and high power devices
Silicon based optoelectronic device and its integration technology
Research on tunneling field-effect transistor (TFET) devices
Reliability and aging mechanism of semiconductor devices
Influence of advanced packaging and interconnect structures on device performance
Topic 2. Communication
Wireless communication and mobile communication, 5G/6G communication technology
Digital communication, multimedia communication
Internet communication, optical communication and optical network
Satellite and space communications, mobile Internet and terminals
Radio frequency technology, modern switching technology
Communication electronic circuit
Image processing and computer vision
Multimedia signal processing
Internet of Things (IoT) and sensor networks
Quantum computing and quantum communication
Green communication and energy saving technology
Signals and systems
Analog electronics, antennas and radio wave propagation
Topic 3. Integrated circuits
Integrated circuit design and manufacturing
Very large scale Integrated Circuit (VLSI)
System on chip (SoC) design, low power design technology
Integrated circuit testing and verification
Radio Frequency Integrated Circuit (RFIC), Power Management Integrated Circuit (PMIC)
Digital Signal Processor (DSP) and its applications
Three-dimensional integrated circuit and its manufacturing process
System-on-chip (SoC) and integration methods
Chip heterogeneous integration technology
Development and innovation of package level integration technology
Thermal management technology in integrated circuits
Rf integrated circuit and its design optimization
Application of artificial intelligence and machine learning in integrated circuit design
Advanced analog and mixed signal integrated circuits
Power management integrated circuit technology
Reliability and safety challenges in integrated circuit design
Silicon photonics interconnect technology
The latest development of VLSI technology
Emerging memory integration technology
Integrated application of modular MEMS and NEMS
Integration and innovation of intelligent sensing systems
Topic 1. Advanced semiconductor devices
New semiconductor materials and their Applications in devices Design and optimization of high-performance MOSFET
Power device technology for energy efficiency optimization
III-V compound semiconductor devices beyond silicon
Micro-electric semiconductor sensor and its application
Semiconductor lasers and their emerging applications
Graphene and other 2D materials devices
Quantum dot and quantum well semiconductor devices
New memory devices: RRAM, MRAM, FeRAM
Challenges and opportunities for cryoelectronic devices
Breakthrough technology for high frequency and high power devices
Silicon based optoelectronic device and its integration technology
Research on tunneling field-effect transistor (TFET) devices
Reliability and aging mechanism of semiconductor devices
Influence of advanced packaging and interconnect structures on device performance
Topic 2. Communication
Wireless communication and mobile communication, 5G/6G communication technology
Digital communication, multimedia communication
Internet communication, optical communication and optical network
Satellite and space communications, mobile Internet and terminals
Radio frequency technology, modern switching technology
Communication electronic circuit
Image processing and computer vision
Multimedia signal processing
Internet of Things (IoT) and sensor networks
Quantum computing and quantum communication
Green communication and energy saving technology
Signals and systems
Analog electronics, antennas and radio wave propagation
Topic 3. Integrated circuits
Integrated circuit design and manufacturing
Very large scale Integrated Circuit (VLSI)
System on chip (SoC) design, low power design technology
Integrated circuit testing and verification
Radio Frequency Integrated Circuit (RFIC), Power Management Integrated Circuit (PMIC)
Digital Signal Processor (DSP) and its applications
Three-dimensional integrated circuit and its manufacturing process
System-on-chip (SoC) and integration methods
Chip heterogeneous integration technology
Development and innovation of package level integration technology
Thermal management technology in integrated circuits
Rf integrated circuit and its design optimization
Application of artificial intelligence and machine learning in integrated circuit design
Advanced analog and mixed signal integrated circuits
Power management integrated circuit technology
Reliability and safety challenges in integrated circuit design
Silicon photonics interconnect technology
The latest development of VLSI technology
Emerging memory integration technology
Integrated application of modular MEMS and NEMS
Integration and innovation of intelligent sensing systems
Important Dates/重要日期
- Submission Deadline: 2026.7.21
- Registration Deadline: 2026.7.28
- Conference Date: 2026.8.5
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: eirma_ais@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
蒋老师
+86-15680824672(微信同号)
3761629232
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+86---(微信同号)
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