(Topics include but are not limited to)
Topic 1: Communication
Intelligent computing applications
Information System Security and Management
Computer Networks and Communication
Mobile communication and wireless technology
Communication network and infrastructure management
Network Engineering and Security
Information security algorithms and protocols
5G mobile communication and intelligent computing communication
Intelligent communication/information security, etc
Topic 2: Integrated Circuits
High performance integrated circuit design
Digital Circuit Design
Analog Circuit Design
ADC/DAC design
Low power logic circuit design
FPGA architecture design
Embedded processors and system design
RF front-end design and optimization
Integrated Sensor Design
Micro processing technology
Lithography technology
Advanced packaging technologies such as TSV, CUNCAP
Aging and Fault Analysis of Integrated Circuits
Integrated Circuit Safety
Design and Optimization of Integrated Electric Vehicle Drive System
Fault diagnosis and repair technology
Topic 3: Microelectronics
Battery Management System
Circuit and Electronics
Micro electronic device technology
Nano electromechanical system
Robotics and Atomization Engineering
Wind power generation equipment
Signal integrity design of high-speed digital systems
Analog Electronic Technology
Digital Electronic Technology
Device Physics
Process technology
Material preparation
Automated testing, packaging, and assembly
Solid State Physics
thermodynamics