Scopes
(Topics include but are not limited to)
Topic 1: Integrated Circuit Design
High performance integrated circuit design
Digital Circuit Design
Analog Circuit Design
ADC/DAC design
Low power logic circuit design
FPGA architecture design
Embedded processors and system design
RF front-end design and optimization
Integrated Sensor Design
Micro processing technology
Lithography technology
Advanced packaging technologies such as TSV, CuNCAP
Aging and Fault Analysis of Integrated Circuits
Integrated Circuit Safety
Design and Optimization of Integrated Electric Vehicle Drive System
Fault diagnosis and repair technology
Other related topics
Topic 2: Intelligent Manufacturing
Intelligent Manufacturing
Connection process/processing
Rapid Manufacturing Technology
Engine manufacturing
Intelligent control technology
Manufacturing technology of wires and cables
Manufacturing process planning and scheduling
Nanomanufacturing
Non traditional manufacturing industry
Mechanical Design and Manufacturing
Manufacturing and repair of internal combustion engines
Manufacturing of communication signal equipment
Medium/micro manufacturing equipment and processes
Modeling, analysis, and simulation of manufacturing processes
Casting and solidification
Precision molding process
Measurement and Measurement
Mold design and manufacturing
Mechanical equipment manufacturing technology
Computer aided design, manufacturing, and engineering

Important Dates | 重要日期
  • Submission Deadline: 2025/6/22
  • Registration Deadline: 2025/6/27
  • Conference Date: 2025/6/29
  • Notification Date: About a week after the submission
Submission Portal | 投稿方式

Mail Address:  paper_infm@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

谢老师
  • 15528045772
  • 3825393354
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