Scopes
Integrated circuit:
High performance integrated circuit design
Digital Circuit Design
Analog Circuit Design
ADC/DAC design
Low power logic circuit design
FPGA architecture design
Embedded processors and system design
RF front-end design and optimization
Integrated Sensor Design
Micro processing technology
Lithography technology
Advanced packaging technologies such as TSV and CuNCAP
Aging and Fault Analysis of Integrated Circuits
Integrated Circuit Safety
Design and Optimization of Integrated Electric Vehicle Drive System
Fault diagnosis and repair technology
Electronic device:
Casting technology and equipment
Welding Technology and Equipment
Plastic processing technology and equipment
Heat treatment technology and equipment
Cutting technology and equipment
Special processing techniques and equipment
Instruments and Apparatuses
Energy machinery and equipment
Chemical machinery and equipment
Textile machinery and equipment
Engineering machinery and equipment
Spacecraft Structure and Design
Circuit equipment and systems
Analog circuits and digital circuits
Electromagnetic and Photonics
Electronic measurement
Programmable controller
Principles and Applications of Sensors
Power Electronics and Energy Systems
Electrician's Inner Line and Electrical Safety
Motor and Electrical Control
Electronic design automation
Nano electromechanical system
Photonics and Optoelectronics
Circuit and Electronics Manufacturing Engineering
Electromagnetics:
Electromagnetic theory
Electromagnetic Education
Electromagnetic field computation 
Electromagnetic measurement
Electromagnetic packaging
Electromagnetic modeling of devices and circuits
Electromagnetic properties of materials
EMC/EMI/Electromagnetic Pulse
Inverse scattering
Metamaterials
Phased array and adaptive array
Printed and conformal antennas
Radar cross-section and asymptotic technique
Random and Nonlinear Electromagnetics
Reflector antenna
Biomagnetism
Brain oscillations and network connectivity
Magnetoencephalography
Important Dates | 重要日期
  • Submission Deadline: 2025.6.5
  • Registration Deadline: 2025.6.10
  • Conference Date: 2025.6.25
  • Notification Date: About a week after the submission
Submission Portal | 投稿方式

Mail Address:  ei_dscis@126.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

唐老师
  • 17168296597
  • 3264234551
田老师
  • 17162865530
  • 3766818743
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