Scopes
(Topics include but are not limited to)
Topic 1: Microelectronics Technology
Chair, Li, Feng, Xia, Frost, Rolling, and Integration
Integrated Circuit Design
EDA and Computing Systems
Sensors and Intelligent Microsystems
Microelectronic devices
Development of Microelectronics Technology
Microelectronics Packaging Technology
Microelectronics Connection Technology
Microelectronics Teaching
Microelectronics technology
Microelectromechanical Systems
Reliability research
Qinjin Mucai Caidou
New principle
New Structure
New architecture
Chip computing power
manufacturing technology 
Testing Technology
Assembly technology
Topic 2: Integrated Circuit Design
Integrated Circuit CAD DFM
Signal denoising, processing, and optimization
Highly integrated front-end circuits and devices
Communication Integrated Circuit
Physical Design of Integrated Circuits and Systems
Devices and circuits for wireless systems
Devices, hardware, and methods for biomimetic and neuromorphic computing
Manufacturing and processing of integrated circuits and devices
Packaging and Testing Technology
Electronic Design Automation (EDA)
Data Path in Digital Processor Architecture
Embedded/Multiprocessor Systems
Hardware software collaborative design and verification
Important Dates/重要日期
  • Submission Deadline: 2025/7/17
  • Registration Deadline: 2025/7/22
  • Conference Date: 2025/7/27
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  icsm_info@126.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

谢老师
  • +86-15528045772(微信同号)
  • 3825393354
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