Scopes
(The following topics include but are not limited to)
Theme 1. Industrial manufacturing
Industrial manufacturing technology structural materials
Intelligent manufacturing technology
Computer integrated manufacturing system
Advanced control and optimization technology
Application of artificial intelligence technology in design and manufacturing
Measurement and control technology and intelligent system
Mechanical and electronic technology, new sensing technology, precision manufacturing technology
Advanced manufacturing production mode
Virtual manufacturing and network manufacturing
Quality control of manufacturing process
Systems analysis and industrial engineering
Microelectronic packaging technology and equipment
Industrial robots and automated production lines
Advanced numerical control technology and equipment
Topic 2. Advanced Semiconductors
Extreme ultraviolet lithography (EUV) technology
3D integrated circuit and its manufacturing process
Advanced packaging and testing technology
Semiconductor manufacturing process optimization and automation
New semiconductor materials and their Applications in devices Design and optimization of high-performance MOSFET
Power device technology for energy efficiency optimization
III-V compound semiconductor devices beyond silicon
Micro-electric semiconductor sensor and its application
Semiconductor lasers and their emerging applications
Graphene and other 2D materials devices
Quantum dot and quantum well semiconductor devices
New memory devices: RRAM, MRAM, FeRAM
Challenges and opportunities for cryoelectronic devices
Breakthrough technology for high frequency and high power devices
Silicon based optoelectronic device and its integration technology
Research on tunneling field-effect transistor (TFET) devices
Reliability and aging mechanism of semiconductor devices
Influence of advanced packaging and interconnect structures on device performance
Theme 3. New materials
Electronic material
Photonics and photoelectric materials
Smart Materials and structures
Energy materials
Two-dimensional materials and applications
3D printing materials
Nanomaterials and nanotechnology
High temperature and superconducting materials
Semiconductor materials, magnetic materials
New functional materials
Functional ceramics
Self-healing material
Thermoelectric material
Important Dates/重要日期
  • Submission Deadline: 2026.7.26
  • Registration Deadline: 2026.8.2
  • Conference Date: 2026.8.10
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  iccane_info@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

蒋老师
  • +86-15680824672(微信同号)
  • 3761629232
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