Scopes
(The following topics include but are not limited to)
Metallic material
Micro/nanomaterials
Composite material
Optical/electronic/magnetic materials
New functional materials/building materials/new energy materials
Smart material
Surface Engineering/Coatings
Deformation mechanics and fracture of materials
Mechanics of materials
Advanced electromagnetism
Material forming process and equipment
Optical/electronic/magnetic materials
Laser physics and technology
Semiconductor material
Mechanical dynamics and its application
Research on high speed signal interconnection and its physical mechanism
Electronic material
Principle and application of mechanical transmission
Irradiation electronics
Micro/nanomaterials
Mechanical and electronic engineering
Telecommunication engineering
Microelectronic system
Mechanical design and manufacturing
Mechanical measurement, control and automation
Condition monitoring, fault diagnosis and intelligent maintenance systems
Artificial Intelligence/Intelligent control
Machine learning/Sensing technology
Object recognition algorithm
Artificial intelligence modeling and simulation
Vibration/contact mechanics/Elastic mechanics
Solid Mechanics/Fluid Mechanics/Rheology
Structural mechanics/Particle mechanics/fracture mechanics
Wave propagation
Welded joint
Experimental mechanics of engineering structures
The mechanics of renewable energy
Fracture and damage mechanics/Computational mechanics
Material properties, measurement methods and applications
Metallic material
Micro/nanomaterials
Composite material
Optical/electronic/magnetic materials
New functional materials/building materials/new energy materials
Smart material
Surface Engineering/Coatings
Deformation mechanics and fracture of materials
Mechanics of materials
Advanced electromagnetism
Material forming process and equipment
Optical/electronic/magnetic materials
Laser physics and technology
Semiconductor material
Mechanical dynamics and its application
Research on high speed signal interconnection and its physical mechanism
Electronic material
Principle and application of mechanical transmission
Irradiation electronics
Micro/nanomaterials
Mechanical and electronic engineering
Telecommunication engineering
Microelectronic system
Mechanical design and manufacturing
Mechanical measurement, control and automation
Condition monitoring, fault diagnosis and intelligent maintenance systems
Artificial Intelligence/Intelligent control
Machine learning/Sensing technology
Object recognition algorithm
Artificial intelligence modeling and simulation
Vibration/contact mechanics/Elastic mechanics
Solid Mechanics/Fluid Mechanics/Rheology
Structural mechanics/Particle mechanics/fracture mechanics
Wave propagation
Welded joint
Experimental mechanics of engineering structures
The mechanics of renewable energy
Fracture and damage mechanics/Computational mechanics
Material properties, measurement methods and applications
Important Dates | 重要日期
- Submission Deadline: 2026.6.7
- Registration Deadline: 2026.6.14
- Conference Date: 2026.6.22
- Notification Date: About a week after the submission
Submission Portal | 投稿方式
Mail Address: ichams_info@126.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
徐老师
MEMSM 2025
1347638002
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