Scopes
(The following topics include but are not limited to)
Topic 1. Materials Physics
Materials physics and structure
Material heat
Fundamentals of materials engineering
Quantum mechanics
Mechanical properties of materials
Microelectronic material
superconductor
Materials physics and Chemistry
Material preparation technology
Atomic physics, solid state physics
Photoelectric material
semiconductor
Nanomaterials and nanotechnology
Topic 2. Advanced Semiconductors
Spin physics and topological phenomena in semiconductors
Semiconductor nano and device
Wide/narrow band gap semiconductors
Compound semiconductor
Magnetic semiconductor
Organic semiconductor
Photoelectric and photovoltaic devices
Semiconductor physics
Semiconductor quantum computing
Physics of microwave photonic devices
Semiconductor materials and device reliability
Semiconductor manufacturing and application
Emerging semiconductor technology
Advanced photoresist
Topic 3. Quantum Mechanics
Vibration, contact mechanics, elastic mechanics
Solid mechanics, fluid mechanics, rheology
Structural mechanics, particle mechanics, fracture mechanics
Wave propagation
Welded joint
Experimental mechanics of engineering structures
The mechanics of renewable energy
Fracture and damage mechanics
Computational mechanics
Material properties, measurement methods and applications, etc
Important Dates/重要日期
  • Submission Deadline: 2026.7.19
  • Registration Deadline: 2026.7.26
  • Conference Date: 2026.8.3
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  eirma_ais@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

蒋老师
  • +86-15680824672(微信同号)
  • 3761629232
--
  • +86---(微信同号)
  • --