Scopes
(Topics include but are not limited to)
Topic 1: Microelectronics Technology
Devices and Integration
integrated circuit design
EDA and Computing Systems
Sensors and Intelligent Microsystems
Microelectronic devices
Development of Microelectronics Technology
Microelectronics Packaging Technology
Microelectronics Connection Technology
Microelectronics Teaching
Microelectronic process
MEMs
Reliability research
New materials
New Principles
new structure
new architecture
Chip computing power
manufacturing technology 
Test technology
assembly technology
Topic 2: Signal Processing
Radar signal processing
Underground remote sensing
Biomedical Signal Processing
Ocean/Underwater Signal Processing
Aviation and equipment signal processing
Multimedia signal processing
Signal Encoding and Data
nonlinear signal processing
information theory and coding
control algorithm
Digital signal processing
target detection and tracking
Array signal processing
Signal Processing and Neural Networks
Topic 3: Circuit Design
Integrated Circuit CAD, DFM
Signal denoising, processing, and optimization
Highly integrated front-end circuits and devices
Communication Integrated Circuit
Physical Design of Integrated Circuits and Systems
Devices and circuits for wireless systems
Devices, hardware, and methods for biomimetic and neuromorphic computing
Manufacturing and processing of integrated circuits and devices
Packaging and Testing Technology
Electronic Design Automation (EDA)
Data Path in Digital Processor Architecture
Embedded/Multiprocessor Systems
Hardware software collaborative design and verification
Important Dates/重要日期
  • Submission Deadline: 2025/6/8
  • Registration Deadline: 2025/6/13
  • Conference Date: 2025/6/16
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  ei_saime@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

谢老师
  • +86-15528045772(微信同号)
  • 3825393354
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