Scopes
(Topics include but are not limited to)
Topic 1: Plasma Physics
Astrophysics and Fundamental Plasma Physics Theory
Conduct analysis and synthesis
Understand the basic laws of plasma physics
Plasma magnetic reconnection
Magnetospheric Physics
Solar wind turbulence
Experimental plasma
Basic theory, measurement techniques, and calculation methods of discharge plasma
Modification and preparation of discharge plasma materials
Discharge plasma environment and energy applications
Application of discharge plasma in aerospace
Biomedical applications of discharge plasma
Discharge plasma strong magnetic confinement technology
Discharge plasma and wall treatment and auxiliary heating technology
Plasma and Plasma Physics
plasma
Plasma Physics
Basic properties of plasma
Charge shielding phenomenon and plasma quasi electric neutrality
Plasma oscillation and plasma oscillation frequency
Collision of plasma
Definition of Plasma
Plasma radiation
Plasma Parameters and Classification
Plasma parameters
Plasma classification
Description method of plasma
Single particle orbit description method
Magnetohydrodynamic description method
Statistical descriptive method
Particle simulation method
Topic 2: Microelectronics
electronic science and technology
Microelectronics Science and Engineering
Analog Electronic Circuit
Digital circuit
High frequency electronic circuit
signal and system
Principles of Communication
electromagnetics
Electromagnetic Fields and Waves
Solid state physics and semiconductor physics
microelectronics
optoelectronics
integrated circuit design
Optical fiber communication
Thermodynamics and statistical physics
information transmission
information interchange
information processing
signal detection
Integrated Circuit Design and Manufacturing
Electronic components
Physical Electronics and Optoelectronics
electromagnetic field and microwave technology
Instrumentation Technology
Computer Engineering and Applications
Research on New Devices
process development
Advanced System Packaging
3D integration
Integrated Circuit Equipment Materials
Digital Integrated Circuits and Systems
Preparation of new materials
optical sensor
biosensor
Design of New Computing Architecture Chips
Internet of Things and Intelligent Sensor Design
Innovative sensor solutions
New quantitative methods
Topic 3: Materials Engineering
material science and engineering
Material Processing Technology
Metal alloy
Tool materials
Ceramics and Glass
composite material
nanomaterials
biomaterial
Multifunctional Materials
Biological profile
Sensors and surfaces
Multi functional magnetic material
superconducting material
Material properties, measurement methods, and applications
ductility
crack  resistance
tired
Fracture mechanics
Mechanical properties
Electrical performance and magnetism
Corrosion and erosion
wear resistance
NDT
reliability evaluation
toxicity
Metallic materials
Micro / Nano Materials
semiconductor material
Optical/Electronic/Magnetic Materials
New functional materials
building material
New energy materials
Intelligent/Smart Materials
Surface Engineering/Coatings
Material Deformation Mechanics and Fracture
Important Dates/重要日期
  • Submission Deadline: 2025.8.6
  • Registration Deadline: 2025.8.11
  • Conference Date: 2025.8.15
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  iscedp_info@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

肖老师
  • +86-17172888836(微信同号)
  • 3770887106
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