Welcome to IASEDT 2025

2025 International Conference on Advanced Semiconductors, Electronic Devices and Integrated Technologies

Scopes
(The following topics include but are not limited to)
Topic 1. Advanced Semiconductors
New semiconductor materials and their Applications in devices Design and optimization of high-performance MOSFET
Power device technology for energy efficiency optimization
III-V compound semiconductor devices beyond silicon
Micro-electric semiconductor sensor and its application
Semiconductor lasers and their emerging applications
Graphene and other 2D materials devices
Quantum dot and quantum well semiconductor devices
New memory devices: RRAM, MRAM, FeRAM
Challenges and opportunities for cryoelectronic devices
Breakthrough technology for high frequency and high power devices
Silicon based optoelectronic device and its integration technology
Research on tunneling field-effect transistor (TFET) devices
Reliability and aging mechanism of semiconductor devices
Influence of advanced packaging and interconnect structures on device performance
Topic 2. Electronic devices
Spacecraft structure and design
Circuit equipment and systems
Analog circuits and digital circuits
Electromagnetism and photonics
Electronic measurement
Programmable controller
Principle and application of sensor
Power electronics and energy systems
Electrical wiring and electrical safety
Motors and electrical control
Electronic design automation
Nanoelectromechanical system
Photonics and optoelectronics
Circuits and electronics manufacturing engineering
Topic 3. Integration technology
Three-dimensional integrated circuit and its manufacturing process
System-on-chip (SoC) and integration methods
Chip heterogeneous integration technology
Development and innovation of package level integration technology
Thermal management technology in integrated circuits
Rf integrated circuit and its design optimization
Application of artificial intelligence and machine learning in integrated circuit design
Advanced analog and mixed signal integrated circuits
Power management integrated circuit technology
Reliability and safety challenges in integrated circuit design
Silicon photonics interconnect technology
The latest development of VLSI technology
Emerging memory integration technology
Integrated application of modular MEMS and NEMS
Integration and innovation of intelligent sensing systems
Important Dates | 重要日期
  • Submission Deadline: 2025.8.2
  • Registration Deadline: 2025.8.9
  • Conference Date: 2025.8.17
  • Notification Date: About a week after the submission
Submission Portal | 投稿方式

Mail Address:  icamf_info@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

蒋老师
  • +86-15680824672(微信同号)
  • 3761629232
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Indexing Service | 索引服务